US 12,451,418 B2
Printed circuit board and electronic component package including the same
Young Kuk Ko, Suwon-si (KR); Chi Won Hwang, Suwon-si (KR); and Sang Hoon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 6, 2022, as Appl. No. 17/903,337.
Claims priority of application No. 10-2021-0139073 (KR), filed on Oct. 19, 2021.
Prior Publication US 2023/0117940 A1, Apr. 20, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer having at least one recess portion in one surface thereof;
a first wiring layer embedded in the one surface of the first insulating layer; and
a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally from a lower surface of the recess portion,
wherein the first via layer further includes a second via penetrating through at least a portion of the first insulating layer and tapered in a direction opposite to that of the first via.