US 12,451,413 B2
Packaged semiconductor devices with leadframes having tie bar with recessed cavity
Soon Lee Liew, Ipoh (MY); Eng Wah Woo, Ipoh (MY); and Alexander Komposch, Morgan Hill, CA (US)
Assigned to MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed by MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed on May 3, 2024, as Appl. No. 18/654,125.
Application 18/654,125 is a division of application No. 17/504,284, filed on Oct. 18, 2021, granted, now 12,009,286.
Prior Publication US 2024/0282679 A1, Aug. 22, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 23/3178 (2013.01); H01L 23/481 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A leadframe blank, comprising:
a first package blank,
a second package blank, and
a tie bar between the first package blank and the second package blank, wherein the tie bar comprises a recessed cavity therein;
wherein each of the first and second package blanks comprises a plurality of leads attached to the tie bar at respective attachment points;
wherein at least one lead of the plurality of leads of the first package blank is attached to the tie bar at one of the attachment points and at least one lead of the plurality of leads of the second package blank is attached to the tie bar at the one of the attachment points; and
wherein the recessed cavity is formed in the tie bar at the one of the attachment points.