US 12,451,410 B2
Semiconductor package module including vertical terminals
Yun Hwa Choi, Busan (KR)
Assigned to JMJ Korea Co., Ltd., Busan (KR)
Filed by JMJ Korea Co., Ltd., Busan (KR)
Filed on Feb. 13, 2023, as Appl. No. 18/109,190.
Claims priority of application No. 10-2022-0044768 (KR), filed on Apr. 11, 2022.
Prior Publication US 2023/0326830 A1, Oct. 12, 2023
Int. Cl. H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/4334 (2013.01) [H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 25/0652 (2013.01); H01L 24/46 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package module comprising vertical terminals comprising:
a first semiconductor package comprising one or more substrates on which one or more semiconductor chips are installed, one or more metal bridges electrically connected to any one or more of the semiconductor chips and the substrates, one or more terminals electrically connected to any one or more of the semiconductor chips and the substrates, and a first housing covering the semiconductor chips and a part of the terminals, wherein one surface of the metal bridge is at least partly exposed to one surface of the first housing to enable electrical connection and one surface of the substrate is at least partly or entirely exposed to one surface or both surfaces of the first housing; and
a second semiconductor package comprising a second housing stacked on the upper part or the lower part of the first semiconductor package, one or more terminal joining units electrically or structurally connected to one surface of the metal bridge exposed to one surface of the first housing, and the vertical terminals structurally connected to the terminal joining units, wherein the vertical terminals extend by penetrating the second housing.