US 12,451,408 B2
Package structures
Pu Wang, Hsinchu (TW); Chin-Fu Kao, Taipei (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 14, 2024, as Appl. No. 18/772,247.
Application 18/772,247 is a continuation of application No. 17/665,608, filed on Feb. 7, 2022, granted, now 12,068,218.
Application 17/665,608 is a continuation of application No. 16/790,700, filed on Feb. 13, 2020, granted, now 11,289,399, issued on Mar. 29, 2022.
Claims priority of provisional application 62/906,708, filed on Sep. 26, 2019.
Prior Publication US 2024/0371724 A1, Nov. 7, 2024
Int. Cl. H01L 23/373 (2006.01); H01L 21/50 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01)
CPC H01L 23/3735 (2013.01) [H01L 21/50 (2013.01); H01L 23/367 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure comprising:
a substrate;
a first die and a second die, bonded to the substrate;
a first thermal conductive layer, inserted between the first die and the second die;
a heat spreader, disposed on the substrate to cover the first die and the second die; and
a second thermal conductive layer different from the first thermal conductive layer, wherein the second thermal conductive layer is disposed between the first thermal conductive layer and the heat spreader, wherein the first die has a plurality of protrusions thereon, and the first thermal conductive layer is inserted between the protrusions.