US 12,451,407 B2
Composite material, semiconductor package, and method of manufacturing composite material
Toru Maeda, Osaka (JP); Miki Miyanaga, Osaka (JP); Daisuke Kondo, Osaka (JP); Kei Hirai, Osaka (JP); Masayuki Ito, Yamagata (JP); and Shin-Ichi Yamagata, Yamagata (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP); and A.L.M.T. Corp., Tokyo (JP)
Appl. No. 18/268,333
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP); and A.L.M.T. Corp., Tokyo (JP)
PCT Filed Dec. 22, 2021, PCT No. PCT/JP2021/047541
§ 371(c)(1), (2) Date Jun. 20, 2023,
PCT Pub. No. WO2022/138711, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 2020-214612 (JP), filed on Dec. 24, 2020.
Prior Publication US 2024/0304514 A1, Sep. 12, 2024
Int. Cl. F28F 7/00 (2006.01); B22F 7/04 (2006.01); B32B 15/01 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/3735 (2013.01) [B22F 7/04 (2013.01); B32B 15/01 (2013.01); H01L 21/4871 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A composite material having a plate shape, the composite material having a first surface and a second surface opposite to the first surface, the composite material comprising:
a plurality of first layers; and
at least one second layer, wherein
the first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface,
each of the first layers is a layer including copper,
the second layer is a layer of a molybdenum powder compact impregnated with copper, and
wherein the plurality of first layers are bonded to opposite surfaces of the at least one second layer such that a compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.