US 12,451,396 B2
Semiconductor package and method of forming same
Chen-Shien Chen, Zhubei (TW); Ting-Hao Kuo, Hsinchu (TW); Hsu-Hsien Chen, Hsinchu (TW); and Yu-chih Huang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 13, 2022, as Appl. No. 17/743,999.
Claims priority of provisional application 63/230,103, filed on Aug. 6, 2021.
Prior Publication US 2023/0040030 A1, Feb. 9, 2023
Int. Cl. H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 23/48 (2006.01)
CPC H01L 22/20 (2013.01) [H01L 21/6835 (2013.01); H01L 22/34 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/037 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/06505 (2013.01); H01L 2224/117 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80379 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80905 (2013.01); H01L 2224/80948 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/96 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package, the method comprising:
attaching a first package component to a first carrier;
attaching a second package component to the first carrier, the second package component laterally displaced from the first package component;
attaching a third package component to the first package component, the third package component being electrically connected to the first package component;
removing the first carrier from the first package component and the second package component;
after removing the first carrier, performing a first circuit probe test on a metal pad of the second package component to obtain first test data of the second package component; and
comparing the first test data of the second package component with prior data of the second package component.