US 12,451,395 B2
Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device
Tsuyoshi Tazawa, Tokyo (JP); Naohiro Kimura, Tokyo (JP); Keisuke Ohkubo, Tokyo (JP); and Yoshinobu Ozaki, Tokyo (JP)
Appl. No. 17/609,403
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed May 10, 2019, PCT No. PCT/JP2019/018812
§ 371(c)(1), (2) Date Nov. 8, 2021,
PCT Pub. No. WO2020/230209, PCT Pub. Date Nov. 19, 2020.
Prior Publication US 2022/0216114 A1, Jul. 7, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC H01L 22/10 (2013.01) [H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for evaluating a dicing/die-bonding integrated film, the method comprising:
preparing a dicing/die-bonding integrated film serving as an evaluation target, the dicing/die-bonding integrated film including a base layer, an adhesive layer having a first surface facing the base layer and a second surface opposite to the first surface, and a bonding adhesive layer provided to cover a center portion of the second surface of the adhesive layer;
pasting a silicon wafer having a thickness of 50 μm to the bonding adhesive layer and pasting a dicing ring to the second surface of the adhesive layer;
singulating the silicon wafer and the bonding adhesive layer into a plurality of bonding adhesive piece-attached chips including a bonding adhesive piece-attached chip having a square shape having a side length of 2 mm;
pushing a center portion of the bonding adhesive piece-attached chip from a side of the base layer at a temperature of 23° C. at a rate of 60 mm/min;
measuring an edge peeling strength when an edge of the bonding adhesive piece-attached chip is peeled off from the adhesive layer, while the center portion of the bonding adhesive piece-attached chip is pushed; and
determining that the dicing/die-bonding integrated film has favorable pickup property when the edge peeling strength is 1.2 N or less.