US 12,451,382 B2
Tray and destructive analysis automation apparatus including the same
Youn Gon Oh, Hwaseong-si (KR); Ji Hun Kim, Uiwang-si (KR); Sae Yun Ko, Hwaseong-si (KR); Gil Ho Gu, Hwaseong-si (KR); Dong Su Kim, Incheon (KR); Eun Hee Lee, Hwaseong-si (KR); Ho Chan Lee, Seoul (KR); Seong Sil Jeong, Incheon (KR); and Seong Pyo Hong, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 12, 2022, as Appl. No. 17/718,754.
Claims priority of application No. 10-2021-0128675 (KR), filed on Sep. 29, 2021.
Prior Publication US 2023/0101674 A1, Mar. 30, 2023
Int. Cl. H01L 21/673 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67333 (2013.01) [H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A tray comprising:
a plate comprising a first region and a second region;
a first groove, on the first region of the plate, to which a stub is fixed; and
a second groove, on the second region of the plate, to which a grid holder is fixed,
wherein the stub is configured to store test wafer pieces, and
wherein the grid holder is configured to store a test sample that is formed by cutting the test wafer pieces.