US 12,451,378 B2
Wax coating apparatus for wafer mounting and wafer mounting apparatus including same
Kwang Nyeong Jang, Gumi-si (KR)
Assigned to SK SILTRON CO., LTD., Gumi-si (KR)
Filed by SK SILTRON CO., LTD., Gumi-si (KR)
Filed on Feb. 7, 2023, as Appl. No. 18/106,931.
Claims priority of application No. 10-2022-0017484 (KR), filed on Feb. 10, 2022.
Prior Publication US 2023/0253220 A1, Aug. 10, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6715 (2013.01) [H01L 21/67103 (2013.01); H01L 21/6838 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wax coating apparatus for wafer mounting, the wax coating apparatus comprising:
a vacuum chuck in which a vacuum flow path providing vacuum pressure is embedded;
a heating plate mounted on an upper side of the vacuum chuck and having holes and grooves connected to the vacuum flow path of the vacuum chuck in order to suck a block to which a wafer is adhered;
a rotating shaft connected to a lower side of the vacuum chuck;
a driving motor for rotating the rotating shaft; and
a wax nozzle provided to be spaced apart from the upper side of the vacuum chuck,
wherein the heating plate includes an upper plate and is operated so as to heat the block while the wax nozzle sprays wax on the block,
wherein the upper plate includes a central hole communicating with the vacuum flow path of the vacuum chuck at a center thereof,
a pair of linear-shaped grooves crossing each other based on the central hole, and
a ring-shaped groove connecting both ends of the linear-shaped grooves to each other.