US 12,451,377 B2
Robotic cover sealer
Richard D. Richardson, Kennett Square, PA (US)
Assigned to MicroCircuit Laboratories, LLC, Kennett Square, PA (US)
Appl. No. 18/858,306
Filed by MicroCircuit Laboratories, LLC, Kennett Square, PA (US)
PCT Filed Apr. 1, 2024, PCT No. PCT/US2024/022537
§ 371(c)(1), (2) Date Oct. 19, 2024,
PCT Pub. No. WO2024/207014, PCT Pub. Date Oct. 3, 2024.
Claims priority of provisional application 63/456,354, filed on Mar. 31, 2023.
Prior Publication US 2025/0112060 A1, Apr. 3, 2025
Int. Cl. H01L 21/67 (2006.01); B23K 1/00 (2006.01); B23K 101/40 (2006.01)
CPC H01L 21/67126 (2013.01) [B23K 1/0016 (2013.01); B23K 2101/40 (2018.08)] 13 Claims
OG exemplary drawing
 
1. A sealing system comprising:
a processor configured to at least:
obtain input data comprising one or more of a set of package parameters associated with a package, a set of cover parameters associated with a cover, a set of seal ring parameters associated with a seal ring, or a set of power parameters;
based at least on the set of cover parameters and the set of package parameters, accurately place the cover on top of the package;
determine, using a vision system associated with the hermetic sealing system, that a clearance condition associated with the package and the cover is satisfied based on the obtained input data;
based on the clearance condition being satisfied, determine a height associated with an electrode, wherein the height associated with the electrode is adjusted based on one or more of the set of cover parameters or the set of package parameters;
based on the determination of the height associated with the electrode, position a hold down to engage with the cover, position the electrode, and determine a force to apply, using the electrode, to the cover and a seal ring associated with the package; and
seal the cover to the package using the determined force to apply to the cover and the seal ring associated with the package, wherein the hold down remains engaged with the cover when the cover is sealed to the package.