US 12,451,374 B2
Bonding system and inspection method of inspecting combined substrate
Yoshitaka Otsuka, Koshi (JP); Shigeto Tsuruta, Koshi (JP); Yuji Mimura, Koshi (JP); Hiroshi Maeda, Koshi (JP); Eiji Manabe, Koshi (JP); Hisanori Hizume, Sapporo (JP); Shinichi Shinozuka, Koshi (JP); and Hironori Tanoue, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/754,659
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Sep. 28, 2020, PCT No. PCT/JP2020/036623
§ 371(c)(1), (2) Date Apr. 8, 2022,
PCT Pub. No. WO2021/070661, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-186568 (JP), filed on Oct. 10, 2019.
Prior Publication US 2022/0415673 A1, Dec. 29, 2022
Int. Cl. H01L 21/67 (2006.01); G06T 7/00 (2017.01)
CPC H01L 21/67092 (2013.01) [G06T 7/001 (2013.01); H01L 21/67288 (2013.01); G06T 2207/30148 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A bonding system, comprising:
a bonding device configured to form a combined substrate by bonding a first substrate and a second substrate to each other;
an inspection device configured to inspect the combined substrate; and
a controller configured to control the inspection device,
wherein the controller includes:
a measurement controller configured to cause the inspection device to measure the combined substrate at a first number of measurement points;
a comparison unit configured to compare, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result; and
a re-measurement controller configured to cause the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.