US 12,451,372 B2
Filler member and substrate treating apparatus
Ju Yeon Song, Sokcho-si (KR); and Sang Min Lee, Seoul (KR)
Assigned to Semes Co., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 25, 2024, as Appl. No. 18/926,562.
Claims priority of application No. 10-2023-0144942 (KR), filed on Oct. 26, 2023.
Prior Publication US 2025/0140577 A1, May 1, 2025
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67034 (2013.01) [H01L 21/67051 (2013.01); H01L 21/6719 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a chamber providing a treatment space therein;
a substrate support member located inside the chamber and for supporting a substrate;
an upper supply port provided on a top wall of the chamber and supplying a treatment fluid into the treatment space of the chamber;
a lower supply port provided on a bottom wall of the chamber and supplying a treatment fluid into the treatment space; and
a filler member located between the lower supply port and the substrate supported by the substrate support member,
the filler member including a plate with a plurality of perforations and a plurality of support rods located below the plate,
wherein, when viewed from above, the plurality of the support rods surround the lower supply port, and support the plate,
a portion of the treatment fluid supplied through the lower supply port is-being supplied to the substrate through the plurality of perforations formed in the plate, and another portion of the treatment fluid is supplied to the substrate through a space formed between adjacent rods of the plurality of the support rods,
the plurality of perforations being in a collision shape such that streams of the treatment fluid passing through the plurality of perforations collide with each other.