US 12,451,371 B2
Substrate processing apparatus and substrate processing method
Kang Sul Kim, Cheonan-si (KR); Tae-Keun Kim, Cheonan-si (KR); Junhee Choi, Cheonan-si (KR); Kyeong Min Lee, Cheonan-si (KR); and Yong Jun Kim, Cheonan-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 26, 2023, as Appl. No. 18/495,180.
Claims priority of application No. 10-2022-0164390 (KR), filed on Nov. 30, 2022.
Prior Publication US 2024/0178009 A1, May 30, 2024
Int. Cl. H01L 21/67 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67028 (2013.01) [H01L 21/6715 (2013.01); H01L 21/02057 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a housing having a processing space defined therein in which a substrate is processed;
a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate;
a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support, the chemical liquid including a volatile component; and
a controller configured to control the chemical liquid supply to spray the chemical liquid toward the upper surface of the substrate, and then repeatedly apply a first rotation control signal indicating a first rotation speed and a second rotation control signal indicating a second rotation speed to the substrate support in a process of coating the chemical liquid on the substrate, thereby volatilizing the volatile component in the chemical liquid to convert the chemical liquid into a solid film on the substrate,
wherein the first rotation speed is between 1500 rotations per minute (rpm) and 1800 rpm, and the second rotation speed is between 750 rpm and 1500 rpm and being 500 rpm to 750 rpm less than the first rotation speed.