US 12,451,365 B2
Package device manufacturing method
Kyosuke Kobinata, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Nov. 15, 2022, as Appl. No. 18/055,499.
Claims priority of application No. 2021-190268 (JP), filed on Nov. 24, 2021.
Prior Publication US 2023/0162990 A1, May 25, 2023
Int. Cl. H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 21/78 (2013.01); H01L 22/12 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A package device manufacturing method; the method employing a workpiece, the workpiece having a first side and a second side,
the workpiece having a plurality of planned dividing lines associated with the first side the workpiece, the plurality of planned dividing lines intersecting each other so as to define a plurality of zones marked out by the planned dividing lines, each of the plurality of zones having a first region on which a device chip is to be disposed and a second region outside the first region, each first region including a recessed part, upper surfaces of the second regions being higher than the recessed parts of the first regions, the method comprising:
a device chip disposing step of disposing device chips in the recessed parts of the first regions of the workpiece such that upper surfaces of the device chips are positioned below the upper surfaces of the second regions;
a resin molding step of, after the device chip disposing step, supplying a mold resin to the second regions and the first regions thereby covering the device chips and the workpiece by the mold resin to a height greater than a height of the upper surface of the second regions;
a resin thinning step of, after the resin molding step, thinning the mold resin from the first side of the workpiece to a thickness with which the second regions of the workpiece covered by the mold resin are not exposed and the device chips disposed in the recessed parts of the first regions are not exposed;
ending the resin thinning step with the second regions of the workpiece covered by the mold resin are not exposed and the device chips disposed in the recessed parts of the first regions are not exposed;
a polishing step of, after ending the resin thinning step, polishing the mold resin from the first side by a polishing pad to expose the second regions of the workpiece and further polishing the mold resin and the second regions, the mold resin being disposed on the first regions, by the polishing pad to form a flat surface including the mold resin and the second regions on the first side of the workpiece; and
a dividing step of dividing the workpiece along the planned dividing lines to manufacture individual package devices each including the device chip.