US 12,451,344 B2
Substrate processing method
Noritake Sumi, Kyoto (JP)
Assigned to SCREEN HOLDINGS CO., LTD., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Nov. 14, 2023, as Appl. No. 18/509,055.
Claims priority of application No. 2022-183328 (JP), filed on Nov. 16, 2022.
Prior Publication US 2024/0162034 A1, May 16, 2024
Int. Cl. H01L 21/02 (2006.01); B08B 5/02 (2006.01); B08B 7/00 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/02101 (2013.01) [B08B 5/02 (2013.01); B08B 7/0021 (2013.01); H01L 21/68742 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate processing method, comprising:
supporting a substrate having a liquid film on an upper surface substantially in a horizontal posture by placing the substrate on a flat support tray;
accommodating the support tray into an internal space of a chamber and sealing the internal space;
introducing a gas which is pressurized toward a gap space between a lower surface of the support tray and a bottom surface of the internal space; and
processing the substrate by a supercritical processing fluid by introducing the supercritical processing fluid into the internal space, wherein a pressure difference between an upper space of the support tray and a lower space of the support tray within the processing space is created by introducing the gas such that the lower space has a higher pressure than the upper space.