US 12,451,335 B2
Multi-plate electrostatic chucks with ceramic baseplates
Feng Wang, Sunnyvale, CA (US); Keith Gaff, Fremont, CA (US); and Christopher Kimball, San Jose, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by Lam Research Corporation, Fremont, CA (US)
Filed on Dec. 8, 2023, as Appl. No. 18/534,182.
Application 18/534,182 is a continuation of application No. 15/903,682, filed on Feb. 23, 2018, granted, now 11,848,177.
Prior Publication US 2024/0112893 A1, Apr. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); H01J 37/244 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32715 (2013.01) [H01J 37/244 (2013.01); H01J 37/32082 (2013.01); H01J 37/3244 (2013.01); H01J 37/32522 (2013.01); H01J 37/32568 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/3321 (2013.01); H01L 21/68742 (2013.01)] 41 Claims
OG exemplary drawing
 
1. An electrostatic chuck for a substrate processing system, the electrostatic chuck comprising:
a top plate comprising one or more electrostatic clamping electrodes configured to electrostatically clamp a substrate to the top plate, the top plate being formed of ceramic;
an intermediate layer disposed below the top plate; and
a baseplate distinct from the top plate, disposed below the intermediate layer, and formed of ceramic,
wherein
the intermediate layer bonds the top plate to the baseplate, and
the baseplate comprises
a first portion comprising one or more liquid coolant channels,
a second portion protruding upward from the first portion and having a smaller diameter than an outer diameter of the baseplate,
a first set of one or more gas channels at least partially disposed in the second portion, and
one or more radio frequency (RF) electrodes disposed in the second portion above the one or more gas channels and configured for RF plasma generation.