US 12,451,327 B2
Apparatus for plasma processing
Yohei Yamazawa, Tokyo (JP); Kazuki Moyama, Taiwa-cho (JP); Barton Lane, Austin, TX (US); and Merritt Funk, Austin, TX (US)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 3, 2022, as Appl. No. 17/649,823.
Prior Publication US 2023/0282446 A1, Sep. 7, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/3211 (2013.01) [H01J 37/32091 (2013.01); H01J 37/321 (2013.01); H01J 37/32577 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An antenna for plasma processing, the antenna comprising:
an inner ring located in a first plane;
an outer ring located in the first plane; and
a plurality of spiral arms located in a second plane, the second plane being above the first plane, each spiral arm of the plurality of spiral arms being connected to the inner ring by a respective conductive offset, and each spiral arm of the plurality of spiral arms being connected to the outer ring by another respective conductive offset.