| CPC H01J 37/09 (2013.01) [H01J 37/00 (2013.01); H01J 37/226 (2013.01); H01J 2237/026 (2013.01)] | 16 Claims | 

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               1. An article, comprising: 
            a substantially planar plate comprising an electrically conductive material and structure defining a through aperture, the through aperture configured to be positioned above a conductive surface of a wafer stage; and 
                a field shaping element positioned at the through aperture, the field shaping element being configured to counteract effects of the through aperture on an electric field near the substantially planar plate to minimize or prevent a component of the electrical field from being tangential to the conductive surface of the wafer stage, the field shaping element being electrically conductive and transmissive to light. 
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