US 12,451,310 B2
Solid state relay module heating system and methods
Arkadiusz Cichocki, Wroclaw (PL); Artur Koziol, Dzierzoniow (PL); and Wojciech Tuchorski, Dzierzoniow (PL)
Assigned to Chemelex Europe GmbH, Schaffhausen (CH)
Filed by nVent Services GmbH, Schaffhausen (CH)
Filed on Mar. 28, 2022, as Appl. No. 17/706,427.
Claims priority of provisional application 63/166,541, filed on Mar. 26, 2021.
Prior Publication US 2022/0310338 A1, Sep. 29, 2022
Int. Cl. H01H 50/12 (2006.01); H01H 50/02 (2006.01)
CPC H01H 50/12 (2013.01) [H01H 50/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A solid state relay module configured to be coupled to an electronics enclosure and to receive a solid state relay, the solid state relay module comprising:
a base including a first side and an opposite second side, the base to be coupled to the electronics enclosure;
two cable channels extending from the first side of the base, each of the two cable channels sized to receive a heating cable;
a solid state relay platform defined on the base between the two cable channels, the solid state relay platform sized to receive a solid state relay; and
a heat sink extending from the second side of the base.