US 12,451,294 B2
Multilayer electronic component containing coated conductive particles and method of manufacturing the multilayer electronic component
Young Ah Song, Suwon-si (KR); Bong Gyu Choi, Suwon-si (KR); and Kwang Dong Seong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 4, 2022, as Appl. No. 17/980,880.
Claims priority of application No. 10-2021-0187672 (KR), filed on Dec. 24, 2021.
Prior Publication US 2023/0207215 A1, Jun. 29, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01B 1/22 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01B 1/22 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including:
a plurality of dielectric layers, and
internal electrodes disposed to oppose each other with the dielectric layers interposed therebetween; and
external electrodes connected to the internal electrodes and including a plurality of conductive particles,
wherein the plurality of conductive particles include first conductive particles,
wherein the first conductive particles are plate-shaped conductive particles having a coating layer disposed on a surface thereof,
wherein the coating layer includes Si, and an Si content is 0.3 at % or more and 2.0 at % or less, as compared to the plate-shaped conductive particles, and
wherein an average thickness of the coating layer is 15 nm or more and 60 nm or less.