US 12,451,293 B2
Electronic component
Gyeong Ju Song, Suwon-si (KR); Beomjoon Cho, Suwon-si (KR); Younghun Lee, Suwon-si (KR); Jihong Jo, Suwon-si (KR); and Seungmin Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 28, 2022, as Appl. No. 17/975,828.
Claims priority of application No. 10-2021-0170737 (KR), filed on Dec. 2, 2021.
Prior Publication US 2023/0178304 A1, Jun. 8, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/228 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/06 (2013.01); H01G 4/228 (2013.01); H01G 4/232 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body;
a frame terminal disposed on the external electrode; and
a conductive bonding portion disposed between the external electrode and the frame terminal,
wherein the frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion, and
the groove portion is spaced apart from an edge of the frame terminal and does not penetrate through the frame terminal.