US 12,451,288 B2
Multilayer electronic component
Won Jun Na, Suwon-si (KR); Yun Sung Kang, Suwon-si (KR); Sun Hwa Kim, Suwon-si (KR); Byeong Gyu Park, Suwon-si (KR); and Hoe Chul Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 28, 2023, as Appl. No. 18/127,222.
Claims priority of application No. 10-2022-0175641 (KR), filed on Dec. 15, 2022.
Prior Publication US 2024/0203645 A1, Jun. 20, 2024
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/1281 (2013.01); H01G 4/30 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and
an external electrode disposed on the body,
wherein the internal electrode includes nickel (Ni) and yttrium (Y),
the internal electrode includes a plurality of grains and a grain boundary disposed between the plurality of grains, and wherein yttrium (Y) is included in at least one of the plurality of grains that include nickel (Ni).