US 12,451,168 B2
Memory device and operating method thereof
Jihyun Park, Suwon-si (KR); Jungyu Lee, Suwon-si (KR); Yumin Kim, Suwon-si (KR); Chiweon Yoon, Suwon-si (KR); and Eunchan Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 7, 2023, as Appl. No. 18/230,951.
Claims priority of application No. 10-2023-0010238 (KR), filed on Jan. 26, 2023.
Prior Publication US 2024/0257843 A1, Aug. 1, 2024
Int. Cl. G11C 7/02 (2006.01); G11C 7/10 (2006.01); G11C 7/14 (2006.01)
CPC G11C 7/02 (2013.01) [G11C 7/1057 (2013.01); G11C 7/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a first pad;
a memory cell plane comprising a plurality of memory cells;
a page buffer circuit configured to:
sense the memory cell plane; and
identify, based on the sensing of the memory cell plane, a state stored in a memory cell of the plurality of memory cells, according to a ground voltage; and
a noise cancellation circuit configured to:
receive a first ground voltage from the first pad;
determine a reference voltage based on the first ground voltage;
generate a second ground voltage that offsets a noise voltage, based on the reference voltage; and
 output the second ground voltage to the page buffer circuit.