US 12,450,892 B2
Solid-state imaging device, electronic apparatus, and imaging system
Tomokazu Hibino, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/794,036
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed May 1, 2020, PCT No. PCT/JP2020/018405
§ 371(c)(1), (2) Date Jul. 20, 2022,
PCT Pub. No. WO2021/152877, PCT Pub. Date Aug. 5, 2021.
Claims priority of provisional application 62/967,869, filed on Jan. 30, 2020.
Prior Publication US 2023/0050259 A1, Feb. 16, 2023
Int. Cl. G06V 10/82 (2022.01); G06V 10/774 (2022.01); G06V 10/94 (2022.01); H04N 25/771 (2023.01); H04N 25/772 (2023.01)
CPC G06V 10/82 (2022.01) [G06V 10/774 (2022.01); G06V 10/95 (2022.01); H04N 25/771 (2023.01); H04N 25/772 (2023.01)] 15 Claims
OG exemplary drawing
 
1. A solid-state imaging device comprising:
a pixel array including a plurality of pixels performing photoelectric conversion;
converter that converts an analog pixel signal output from the pixel array into digital image data;
an image processing unit that performs image processing on the digital image data;
a digital signal processing unit that performs recognition processing on the digital image data output by the image processing unit; and
a control unit that performs optimization regarding at least one acquisition processing operation among acquisition of the analog pixel signal, acquisition of the digital image data, and acquisition of a result of the recognition processing when a recognition rate of the recognition processing has decreased, wherein the recognition rate is determined based on a number of images in which a successful recognition has been made.