US 12,450,712 B2
Inspection device and molded-product processing system
Hiroshi Suzuki, Kyoto (JP)
Assigned to KIKUSUI SEISAKUSHO LTD., kyoto (JP)
Filed by KIKUSUI SEISAKUSHO LTD., Kyoto (JP)
Filed on Jan. 27, 2023, as Appl. No. 18/102,199.
Claims priority of application No. 2022-033757 (JP), filed on Mar. 4, 2022.
Prior Publication US 2023/0281780 A1, Sep. 7, 2023
Int. Cl. G06T 7/90 (2017.01); B29C 43/02 (2006.01); B29C 43/58 (2006.01); G06T 7/00 (2017.01)
CPC G06T 7/0004 (2013.01) [B29C 43/02 (2013.01); B29C 43/58 (2013.01); G06T 7/90 (2017.01); B29C 2043/585 (2013.01); B29C 2043/5891 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inspection device for a molded product configured to inspect whether or not the molded product molded into a predetermined shape has defectiveness based on a captured image of the molded product, the inspection device comprising:
a first foreign matter determiner configured to determine whether or not, in an obtained image of the molded product, a first inspection region located inside an outline of an assumed normal molded product includes foreign matter to inspect for defectiveness of the molded product; and
a second foreign matter determiner configured to determine whether or not, in the obtained image of the molded product, a second inspection region located outside the outline of the assumed normal molded product includes foreign matter to inspect for defectiveness of the molded product.