US 12,450,115 B2
Bootloader failure analysis of memory system
Jianping Tian, Shanghai (CN); and Da Hong, SanYang (CN)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jun. 13, 2024, as Appl. No. 18/742,798.
Claims priority of provisional application 63/522,295, filed on Jun. 21, 2023.
Prior Publication US 2024/0427657 A1, Dec. 26, 2024
Int. Cl. G06F 11/07 (2006.01); G06F 9/4401 (2018.01)
CPC G06F 11/0787 (2013.01) [G06F 9/4408 (2013.01); G06F 11/073 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory system comprising:
a set of memory devices; and
a processing device, operably coupled to the set of memory devices, configured to perform operations comprising:
causing bootloader firmware to be loaded from a first memory device of the set of memory devices to a second memory device for execution by the processing device, the first memory device being a first memory type, the second memory device being a second memory type; and
causing the bootloader firmware to be executed from the second memory device by the processing device, the bootloader firmware being configured to cause the processing device to store information regarding a failure of the bootloader firmware to be saved on a third memory device of the set of memory devices in response to detection of the failure, the third memory device being a third memory type, execution of the bootloader firmware causing the processing device to:
initialize a fourth memory device of the set of memory devices, the fourth memory device being a fourth memory type;
cause operational firmware to be loaded from the fourth memory device to the second memory device for execution by the processing device; and
cause the operational firmware to be executed from the second memory device by the processing device.