US 12,449,859 B2
Housing having recess structure and electronic device including same
Hyoseock Heo, Suwon-si (KR); and Yongwon Kim, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 22, 2023, as Appl. No. 18/188,025.
Application 18/188,025 is a continuation of application No. PCT/KR2021/012714, filed on Sep. 16, 2021.
Claims priority of application No. 10-2020-0122109 (KR), filed on Sep. 22, 2020; and application No. 10-2021-0036607 (KR), filed on Mar. 22, 2021.
Prior Publication US 2023/0221770 A1, Jul. 13, 2023
Int. Cl. G06F 1/16 (2006.01); H05K 5/04 (2006.01)
CPC G06F 1/1658 (2013.01) [G06F 1/1635 (2013.01); H05K 5/04 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first metal housing formed at least partially along an edge of the electronic device;
a second metal housing; and
an injection structure at least partially disposed between at least the first metal housing and the second metal housing, and comprising a non-conductive material,
wherein the injection structure and the second metal housing include a recess part disposed along an inner edge of the electronic device and configured to mount an electrical component therein, wherein the recess part includes a first sidewall on an inner side of the electronic device, and a second sidewall spaced from the first sidewall,
wherein the second metal housing includes a first part connected to the first metal housing, and a second part spaced apart from the first metal housing,
wherein the first metal housing includes a protrusion part, and
wherein the protrusion part extends across a part at least partially overlapping a space between the first sidewall and the second sidewall in a thickness direction of the electronic device to the first part and is bonded to the first part.