US 12,449,733 B2
Substrate treating apparatus
Seulgi Han, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 22, 2023, as Appl. No. 18/339,761.
Claims priority of application No. 10-2022-0129555 (KR), filed on Oct. 11, 2022.
Prior Publication US 2024/0118621 A1, Apr. 11, 2024
Int. Cl. G03F 7/16 (2006.01)
CPC G03F 7/162 (2013.01) 20 Claims
OG exemplary drawing
 
1. A substrate treating apparatus, comprising:
a chamber comprising a gate through which a substrate is loaded into the chamber and unloaded from the chamber;
a gas supply unit in an upper portion of the chamber and configured to supply gas into the chamber;
a spin coater in a lower portion of the chamber, the spin coater comprising a spin chuck configured to support and rotate the substrate on an upper surface thereof, and a cup portion extending around the substrate and configured to collect and discharge a chemical liquid from the substrate;
a chemical liquid supply unit configured to supply the chemical liquid onto the substrate; and
a heater between the substrate and the gas supply unit and configured to heat the substrate.