US 12,449,682 B2
Semiconductor device including waveguide heater
Feng-Wei Kuo, Hsinchu (TW); Chewn-Pu Jou, Hsinchu (TW); Huan-Neng Chen, Hsinchu (TW); and Lan-Chou Cho, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jul. 25, 2023, as Appl. No. 18/358,820.
Application 17/865,191 is a division of application No. 16/897,581, filed on Jun. 10, 2020, granted, now 11,409,139, issued on Aug. 9, 2022.
Application 18/358,820 is a continuation of application No. 17/865,191, filed on Jul. 14, 2022, granted, now 11,740,492.
Claims priority of provisional application 62/948,125, filed on Dec. 13, 2019.
Prior Publication US 2023/0367145 A1, Nov. 16, 2023
Int. Cl. G02F 1/01 (2006.01); G02F 1/21 (2006.01); G02F 1/225 (2006.01)
CPC G02F 1/0147 (2013.01) [G02F 1/2257 (2013.01); G02F 1/212 (2021.01); G02F 2201/063 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical device, comprising:
a first waveguide having an arcuate-shaped segment;
a second waveguide including a substantially linearly-shaped segment that is adjacent and tangential to the arcuate-shaped segment of the first waveguide; and
a heater having an arcuate-shaped segment, a radial width of the arcuate-shaped segment of the heater being greater than a radial width of the arcuate-shaped segment of the first waveguide, and the arcuate-shaped segment of the heater overlapping at least a majority of the arcuate-shaped segment of the first waveguide.