US 12,449,618 B2
Low-loss coplanar waveguide bonding structure and manufacturing method thereof
Chen Xiao, Beijing (CN); Rui Xu, Beijing (CN); Boyu Zhang, Beijing (CN); Xiangyu Zheng, Beijing (CN); Wenlong Cai, Beijing (CN); Jiaqi Wei, Beijing (CN); and Weisheng Zhao, Beijing (CN)
Assigned to BEIHANG UNIVERSITY, Beijing (CN)
Filed by BEIHANG UNIVERSITY, Beijing (CN)
Filed on Aug. 2, 2023, as Appl. No. 18/363,984.
Claims priority of application No. 202210924721.6 (CN), filed on Aug. 2, 2022.
Prior Publication US 2024/0045160 A1, Feb. 8, 2024
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4283 (2013.01) [G02B 6/4279 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A low-loss coplanar waveguide bonding structure, comprising:
a first coplanar waveguide on a first substrate;
a second coplanar waveguide on a second substrate and having a same structure as the first coplanar waveguide; and
a plurality of two-dimensional heterostructures uniformly covering and connecting conductors of the first coplanar waveguide and the second coplanar waveguide in a one-to-one correspondence,
wherein the two-dimensional heterostructures comprise: a two-dimensional conductive material layer for signal transmission and a two-dimensional dielectric material layer under the two-dimensional conductive material layer,
wherein the first substrate and the second substrate are different in materials.