US 12,449,617 B2
Optical module
Jiaao Zhang, Shandong (CN); Xinnan Wang, Shandong (CN); and Jianwei Mu, Shandong (CN)
Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed by HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed on Jun. 9, 2023, as Appl. No. 18/331,933.
Application 18/331,933 is a continuation of application No. PCT/CN2021/134678, filed on Dec. 1, 2021.
Claims priority of application No. 202011466259.7 (CN), filed on Dec. 14, 2020; and application No. 202022993019.4 (CN), filed on Dec. 14, 2020.
Prior Publication US 2023/0314741 A1, Oct. 5, 2023
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01); H05K 1/18 (2006.01)
CPC G02B 6/4281 (2013.01) [G02B 6/4284 (2013.01); H05K 1/189 (2013.01); H05K 2201/10121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a first circuit board, wherein golden fingers are provided on surfaces at one end of the first circuit board, a first high-speed signal pad is provided on an upper surface at the other end of the first circuit board, and a second high-speed signal pad is provided on a lower surface at said other end of the first circuit board;
a second circuit board, which is arranged above the first circuit board and is electrically connected to the first circuit board, with a non-high-speed signal pad being provided on a surface of the second circuit board;
a light emitting component, which is arranged above the first circuit board and electrically connected to a first flexible circuit board and a second flexible circuit board respectively, and a tip of the light emitting component is provided with a pin connector;
a light receiving component, wherein the light receiving component and the light emitting component are arranged in a stacked way, one above the other, with the light receiving component being arranged below the light emitting component and being electrically connected to a third flexible circuit board;
the first flexible circuit board electrically connected to an upper surface of the pin connector, with one end of the first flexible circuit board being electrically connected to the light emitting component, and the other end of the first flexible circuit board being electrically connected to the non-high-speed signal pad;
the second flexible circuit board electrically connected to a lower surface of the pin connector, with one end of the second flexible circuit board being electrically connected to the light emitting component, and the other end of the second flexible circuit board being electrically connected to the first high-speed signal pad; and
the third flexible circuit board, with one end of the third flexible circuit board being electrically connected to the light receiving component, and the other end of the third flexible circuit board being electrically connected to the second high-speed signal pad.