US 12,449,596 B2
Optical input/output interfaces between photonics chips
Arpan Dasgupta, Beacon, NY (US); Yusheng Bian, Ballston Lake, NY (US); John M. Safran, Wappingers Falls, NY (US); and Norman Robson, Fishkill, NY (US)
Assigned to GlobalFoundries U.S. Inc., Malta, NY (US)
Filed by GlobalFoundries U.S. Inc., Malta, NY (US)
Filed on Mar. 28, 2023, as Appl. No. 18/127,220.
Prior Publication US 2024/0329308 A1, Oct. 3, 2024
Int. Cl. G02B 6/122 (2006.01); G02B 6/13 (2006.01)
CPC G02B 6/1228 (2013.01) [G02B 6/13 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A structure comprising:
an interposer including a first electrical interconnection;
a first photonics chip including a first edge and a first plurality of optical couplers disposed at the first edge; and
a second photonics chip including a second edge adjacent to the first edge and a second plurality of optical couplers, the second plurality of optical couplers disposed at the second edge adjacent to the first plurality of optical couplers,
wherein the first photonics chip and the second photonics chip are disposed on the interposer, and the first photonics chip and the second photonics chip are coupled by the first electrical interconnection for electrical communication through the interposer.