US 12,449,474 B2
Drive control device, drive control method, program and prober
Eiji Fukano, Hachioji (JP)
Assigned to Tokyo Seimitsu Co., Ltd., Hachioji (JP)
Filed by Tokyo Seimitsu Co., Ltd., Hachioji (JP)
Filed on Feb. 22, 2024, as Appl. No. 18/583,858.
Claims priority of application No. 2023-045535 (JP), filed on Mar. 22, 2023.
Prior Publication US 2024/0319263 A1, Sep. 26, 2024
Int. Cl. G01R 31/28 (2006.01); H01L 21/66 (2006.01)
CPC G01R 31/2887 (2013.01) [G01R 31/2853 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A drive control device comprising:
an operation instruction transmission unit configured to transmit an operation instruction to a motor driving device for operating a movement mechanism of a wafer chuck which holds a wafer on which a plurality of semiconductor chips is formed;
an information acquisition unit configured to acquire a position deviation information including at least one position deviation at an actual position of the wafer chuck with respect to a position of the wafer chuck in the operation instruction;
an analysis unit configured to analyze the position deviation information; and
a determination unit configured to determine an existence or absence of an occurrence of an abnormal operation of the movement mechanism based on an analysis result of the position deviation information.