US 12,449,470 B2
Apparatus and method for monitoring a semiconductor component
Daniel Monteiro Diniz Reis, Esslingen am Neckar (DE); Frank Schatz, Kornwestheim (DE); Mathias Mews, Reutlingen (DE); and Timo Schary, Aichtal-Neuenhaus (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Appl. No. 18/249,039
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Dec. 13, 2021, PCT No. PCT/EP2021/085451
§ 371(c)(1), (2) Date Apr. 13, 2023,
PCT Pub. No. WO2022/144166, PCT Pub. Date Jul. 7, 2022.
Claims priority of application No. 10 2021 200 002.9 (DE), filed on Jan. 4, 2021.
Prior Publication US 2024/0019482 A1, Jan. 18, 2024
Int. Cl. G01R 31/26 (2020.01); G01R 31/52 (2020.01)
CPC G01R 31/2601 (2013.01) [G01R 31/52 (2020.01)] 16 Claims
OG exemplary drawing
 
1. A method for monitoring a semiconductor component, comprising the following steps:
detecting, by a measuring device during operation of the semiconductor component, a leakage current which flows through a first electrode and a second electrode of the semiconductor component;
i) comparing, by a computing device, the leakage current with a first limit value for the leakage current and determining an output based on a result of the comparison and/or ii) determining, by the computing device, a time at which a maximum point of the leakage current occurs and determining the output based on the time, wherein the output includes a state of the semiconductor component; and
outputting, by an output device, the output.