US 12,449,401 B2
Apparatus and method for inspecting electrostatic chuck for substrate processing
Mi Young Jo, Hwaseong-si (KR); Choong Moo Shim, Hwaseong-si (KR); and Young Ran Ko, Daegu (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 21, 2022, as Appl. No. 18/069,400.
Claims priority of application No. 10-2021-0193593 (KR), filed on Dec. 31, 2021; and application No. 10-2022-0129378 (KR), filed on Oct. 11, 2022.
Prior Publication US 2023/0213483 A1, Jul. 6, 2023
Int. Cl. G01N 29/06 (2006.01); G01B 17/02 (2006.01); G01N 29/28 (2006.01); H01L 21/683 (2006.01)
CPC G01N 29/069 (2013.01) [G01B 17/02 (2013.01); G01N 29/28 (2013.01); H01L 21/6833 (2013.01); G01N 2291/0231 (2013.01); G01N 2291/0289 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An apparatus for inspecting an electrostatic chuck for substrate processing, the apparatus comprising:
an electrostatic chuck including a ceramic layer and an electrode layer coupled to an inside of the ceramic layer;
an ultrasonic sensor unit disposed on the electrostatic chuck, configured to allow an ultrasonic wave to be incident into the electrostatic chuck, and configured to convert a reflected signal reflected through the electrostatic chuck into an ultrasonic voltage signal; and
an ultrasonic inspection unit configured to divide the ceramic layer and the electrode layer, based on a voltage amplitude of the ultrasonic voltage signal.