US 12,449,380 B2
Defect analysis device and defect analysis method using the same
Yeon Keon Moon, Yongin-si (KR); Jun Hyung Lim, Yongin-si (KR); Kwun-Bum Chung, Seoul (KR); Kwang Sik Jeong, Seoul (KR); and Hyun Min Hong, Seoul (KR)
Assigned to Samsung Display Co., Ltd., Yongin-Si (KR); and Dongguk University Industry-Academic Cooperation Foundation, Seoul (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR); and Dongguk University Industry-Academic Cooperation Foundation, Seoul (KR)
Filed on Jul. 31, 2023, as Appl. No. 18/227,976.
Claims priority of application No. 10-2022-0118117 (KR), filed on Sep. 19, 2022.
Prior Publication US 2024/0102942 A1, Mar. 28, 2024
Int. Cl. G01N 21/956 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01)
CPC G01N 21/956 (2013.01) [G01N 21/8806 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A defect analysis device comprising:
a light source configured to irradiate an analysis target layer of an element with light;
a position adjuster configured to adjust a position to be irradiated with the light;
a detector configured to measure a current flowing between a source area of the element electrically connected to one end of the analysis target layer and a drain area of the element electrically connected to the other end of the analysis target layer in the element; and
an analyzer configured to acquire quantitative data related to a defect in the analysis target layer on a basis of the current,
wherein, in a first mode, a plurality of areas of the analysis target layer are sequentially irradiated with the light.