US 12,449,378 B2
Edge portion measuring apparatus and method for measuring edge portion
Shigeru Oba, Nishigo-mura (JP)
Assigned to SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU HANDOTAI CO., LTD., Tokyo (JP)
Filed on Jan. 11, 2023, as Appl. No. 18/153,036.
Claims priority of application No. 2022-11283 (JP), filed on Jan. 27, 2022.
Prior Publication US 2023/0258577 A1, Aug. 17, 2023
Int. Cl. G01N 21/95 (2006.01); G01N 21/47 (2006.01); H01L 21/66 (2006.01)
CPC G01N 21/9503 (2013.01) [G01N 21/4738 (2013.01); H01L 22/12 (2013.01); G01N 2021/4783 (2013.01); G01N 2201/101 (2013.01); G01N 2201/103 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An edge portion measuring apparatus for measuring shape of an edge portion of a wafer, comprising:
a holding portion that holds the wafer;
a rotating means for rotating the wafer by rotating the holding portion; and
a sensor which comprises a light projecting portion for projecting a laser light from a light source onto the edge portion of the wafer held by the holding portion, and a light receiving detection unit that receives diffuse reflected light that the laser light projected from the light projecting portion is reflected at the edge portion of the wafer, wherein
the rotating means is configured to rotate the wafer while the wafer is held by the holding portion, the wafer being in subjected to a slicing process, a chamfering process, a lapping/grinding process, or an etching process,
the sensor is configured to project the laser light and receive the diffuse reflected light at least in a range from a normal direction of a held surface of the wafer to a normal direction of a surface opposite to the held surface, and
the edge portion measuring apparatus is configured to measure the shape of an entire area of the edge portion of the wafer by a triangulation method in which an amount of movement of a measurement point with respect to the sensor is measured from an amount of change in an imaging position of the diffuse reflected light received by the sensor.