	US 12,449,375 B2
	Inspection method, substrate processing method including the same, and substrate processing device using the substrate processing method
Myunggeun Song, Suwon-si (KR); Sarah Kim, Suwon-si (KR); Changyul Kim, Suwon-si (KR); Younghoon Kim, Suwon-si (KR); Jaeyong Park, Suwon-si (KR); Sungil Cho, Suwon-si (KR); and Taeil Cho, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 12, 2023, as Appl. No. 18/220,985.
Claims priority of application No. 10-2022-0108716 (KR), filed on Aug. 29, 2022.
Prior Publication US 2024/0201103 A1, Jun. 20, 2024
Int. Cl. G01N 21/94 (2006.01)

CPC G01N 21/94 (2013.01) [G01N 2201/1248 (2013.01)]

20 Claims

1. A substrate processing method comprising:

causing an analysis device to extract a first similarity by comparing first data of a first optical signal with reference data of a reference optical signal;

causing the analysis device to generate a first normal distribution of the first similarity;

causing the analysis device to extract a second similarity by comparing second data of a second optical signal with the reference data;

causing the analysis device to generate a second normal distribution of the second similarity;

causing the analysis device to compare the first normal distribution with the second normal distribution,

wherein the causing the analysis device to extract the first similarity by comparing the first data of the first optical signal with the reference data of the reference optical signal comprises causing the analysis device to derive the first data of the first optical signal, and

wherein the causing the analysis device to derive the first data of the first optical signal comprises:

causing the analysis device to receive spectrum data of the first optical signal collected in a chamber by using optical emission spectrometry;

causing the analysis device to select data of a first section and data of a second section, which have a first section size, from the spectrum data;

causing the analysis device to scale each of the data of the first section and the data of the second section to a value greater than or equal to 0 and less than or equal to 1;

causing the analysis device to convert the scaled data by using a fitting function f(x)=Ae^−ω|x^ⁿ^|+c>, where n is a rational number greater than or equal to 1, and less than or equal to 5;

causing the analysis device to determine a peak probability of each of the data of the first section and the data of the second section by using the fitting function;

if the peak probability of each of the data of the first section and the data of the second section is less than a reference point, causing the analysis device to convert the peak probability into 0; and

if the peak probability of each of the data of the first section and the data of the second section is equal to or greater than the reference point, causing the analysis device to convert the peak probability into 1, and

wherein the analysis device derives the reference data and the second data using a method that is the same as that of the first data;

causing the analysis device to determine whether outside gas inflow occurred in the chamber based on the comparing the first normal distribution with the second normal distribution; and

causing the analysis device to control, based on a result of the determining whether the outside gas inflow occurred in the chamber, a plasma source to process a substrate in the chamber using plasma.