US 12,449,325 B2
Pressure sensor assembly
Rainer Markus Schaller, Saal a.d. Donau (DE); and Horst Theuss, Wenzenbach (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jul. 27, 2022, as Appl. No. 17/874,834.
Claims priority of application No. 102021120690.1 (DE), filed on Aug. 9, 2021.
Prior Publication US 2023/0038134 A1, Feb. 9, 2023
Int. Cl. G01L 19/14 (2006.01); B81B 7/00 (2006.01); G01L 19/00 (2006.01); G01L 19/06 (2006.01)
CPC G01L 19/147 (2013.01) [B81B 7/0048 (2013.01); G01L 19/0069 (2013.01); G01L 19/06 (2013.01); G01L 19/143 (2013.01); G01L 19/145 (2013.01); B81B 2201/0264 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor assembly, comprising:
a housing enclosing a pressure chamber filled with a medium, the housing having a first housing part and a second housing part, the first housing part being connected to the second housing part to seal the pressure chamber in a pressure-tight manner;
a sensor chip arranged in the pressure chamber, surrounded by the medium, and configured to measure a pressure of the medium;
a plurality of connection pins fed through the first housing part by pressure-tight bushings and electrically connected to the sensor chip; and
stress relieving structures configured to mechanically decouple the first housing part and a pressure-sensitive element of the sensor chip.