US 12,449,209 B2
Heat dissipation structure
Dan-Jun Chen, Shenzhen (CN); Guo-Hui Li, Shenzhen (CN); and Jun Wang, Shenzhen (CN)
Assigned to ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD., Shenzhen (CN)
Filed by ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD., Shenzhen (CN)
Filed on Aug. 16, 2023, as Appl. No. 18/234,853.
Prior Publication US 2025/0060170 A1, Feb. 20, 2025
Int. Cl. F28D 15/02 (2006.01); F28F 9/26 (2006.01)
CPC F28D 15/0275 (2013.01) [F28D 15/0266 (2013.01); F28F 9/26 (2013.01); F28F 2275/02 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A heat dissipation structure, comprising:
a base having a bottom surface and a top surface, the bottom surface having at least one receiving groove provided thereon and the top surface having at least one solder dispensing opening provided thereon, and the solder dispensing opening being transversely extended across and communicable with a top of the receiving groove;
a plurality of heat pipes being fitted in the at least one receiving groove on the base; and
a solder layer being formed between the heat pipes and the at least one receiving groove.