US 12,449,084 B2
Methods and apparatus for heating a liquid
Andrew Michael Yednak, III, Phoenix, AZ (US)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on May 15, 2024, as Appl. No. 18/665,202.
Application 18/665,202 is a continuation of application No. 17/944,296, filed on Sep. 14, 2022, granted, now 11,988,316.
Claims priority of provisional application 63/245,461, filed on Sep. 17, 2021.
Prior Publication US 2024/0301980 A1, Sep. 12, 2024
Int. Cl. H01L 21/67 (2006.01); F16L 53/38 (2018.01); C23C 16/455 (2006.01)
CPC F16L 53/38 (2018.01) [H01L 21/67023 (2013.01); C23C 16/45561 (2013.01); Y10T 137/6416 (2015.04)] 19 Claims
OG exemplary drawing
 
1. An apparatus for heating a liquid, comprising:
a valve assembly configured to receive the liquid;
a pipe system downstream from the valve assembly and configured to allow flow of the liquid, wherein the pipe system comprises:
a first portion comprising a first pipe connected directly to the valve assembly and having a first diameter; and
a second portion downstream from the first pipe, wherein the second portion comprises a second pipe having a second diameter that is greater than the first diameter,
wherein the second pipe is configured to accumulate the liquid therein;
a heating system arranged around the second portion configured to heat the liquid in the second pipe;
a source vessel connected to and downstream from the second portion, wherein the source vessel is configured to receive and contain heated liquid from the second pipe and configured to deliver a gas produced from the heated liquid to a reaction chamber for processing; and
the reaction chamber, which is connected to and downstream from the source vessel, wherein the reaction chamber is configured to receive the gas from the source vessel for semiconductor processing within the reaction chamber.