	US 12,448,550 B2
	Dual-curable adhesive composition
Chanho Shin, Gwangju (KR); Joohan Woo, Jeonju-si (KR); Cheolwoo Lee, Jeollabuk-do (KR); Sungmin Ha, Jeollabuk-do (KR); and Chunrae Nam, Jeonju-si (KR)
Assigned to HANSOL CHEMICAL CO., LTD., Seoul (KR)
Appl. No. 17/781,692
Filed by HANSOL CHEMICAL CO., LTD., Seoul (KR)
PCT Filed Dec. 5, 2019, PCT No. PCT/KR2019/017129 § 371(c)(1), (2) Date Jun. 1, 2022, PCT Pub. No. WO2021/112296, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 10-2019-0158833 (KR), filed on Dec. 3, 2019.
Prior Publication US 2023/0015729 A1, Jan. 19, 2023
Int. Cl. C09J 133/04 (2006.01); C09J 4/06 (2006.01); C09J 11/06 (2006.01); C08K 5/37 (2006.01)

CPC C09J 133/04 (2013.01) [C09J 4/06 (2013.01); C09J 11/06 (2013.01); C08K 5/37 (2013.01); C09J 2301/312 (2020.08); C09J 2301/416 (2020.08)]

15 Claims

1. A dual-curable adhesive composition comprising:

at least one type of photo-curable compound;

a photo-initiator;

a thermal initiator having a curing initiation temperature of 35° C. or higher; and

a thiol group-containing compound,

wherein a mixing ratio of the photo-initiator, the thermal initiator, and the thiol group-containing compound is in a range of 1:1 to 5:10 to 100 by weight,

wherein the at least one type of photo-curable compound comprises:

a (meth)acrylate oligomer;

a monofunctional (meth)acrylate monomer;

a bifunctional or more multifunctional (meth)acrylate monomer, and,

a hydroxy group-containing (meth)acrylate monomer, and

said hydroxy group-containing (meth)acrylate monomer being in a range of 0.5 to 3 parts by weight with respect to a total weight of the adhesive composition.