US 12,448,547 B2
Heat separable two-layer adhesive system and process of adhesive debonding using the same
Uwe Franken, Dormagen (DE); Hans-Georg Kinzelmann, Pulheim (DE); Andreas Ferencz, Duesseldorf (DE); and Stefanie Stapf, Essen (DE)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Oct. 7, 2022, as Appl. No. 17/938,802.
Application 17/938,802 is a continuation of application No. PCT/EP2021/059258, filed on Apr. 9, 2021.
Prior Publication US 2023/0039626 A1, Feb. 9, 2023
Int. Cl. C09J 7/40 (2018.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); C09J 201/00 (2006.01)
CPC C09J 7/401 (2018.01) [C09J 5/06 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); C09J 2203/37 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08)] 19 Claims
OG exemplary drawing
 
1. A heat separable two-layer adhesive system, comprising;
a layer of first adhesive; and
a layer of second adhesive bonded to the layer of a first adhesive, wherein the layer of first adhesive comprises:
a) conductive particles selected from the group consisting of silver, gold, palladium, platinum, carbon black, carbon fiber, graphite, indium tin oxide, silver-plated nickel, silver-plated copper, silver-plated graphite, silver-plated aluminum, silver-plated fiber, silver-plated glass, silver-plated polymer, antimony-doped tin oxide, and combinations thereof;
b) diethylene glycol monobutyl ether; and
c) a polyurethane resin,
wherein the conductive particles, diethylene glycol monobutyl ether, and polyurethane resin are mixed together.