	US 12,448,542 B2
	Slurry composition for polishing organic film
Bo Hyeok Choi, Gyeonggi-do (KR); Jae Hak Lee, Gyeonggi-do (KR); Jae Woo Lee, Gyeonggi-do (KR); Ji Hye Kim, Gyeonggi-do (KR); and Jae Ik Lee, Gyeonggi-do (KR)
Assigned to KCTECH Co., Ltd., Anseong-si (KR)
Appl. No. 17/786,741
Filed by KCTECH CO., LTD., Gyeonggi-do (KR)
PCT Filed Oct. 30, 2020, PCT No. PCT/KR2020/095132 § 371(c)(1), (2) Date Jun. 17, 2022, PCT Pub. No. WO2021/125919, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 10-2019-0171515 (KR), filed on Dec. 20, 2019.
Prior Publication US 2023/0033789 A1, Feb. 2, 2023
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/306 (2006.01)

CPC C09G 1/02 (2013.01) [C09K 3/1436 (2013.01); H01L 21/30625 (2013.01)]

16 Claims

1. A slurry composition for polishing an organic film, the slurry composition comprising:

abrasive particles;

a polishing control agent containing an organic acid, an inorganic acid, or both thereof;

an organic film polishing enhancer containing an amide-based compound or an amide-based polymer;

an oxidizing agent; and

a pH control agent,

wherein the organic film polishing enhancer includes polyacrylamide,

wherein the organic film polishing enhancer has a molecular weight of 400 K to 1,000 K,

wherein the organic film includes a carbon-based film containing a carbon-hydrogen bond.