US 12,448,530 B2
Ink composition, light emitting diode, and method for manufacturing light emitting diode
Won-Jun Park, Seoul (KR); Sehun Kim, Yongin-si (KR); and Jaekook Ha, Seoul (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on May 16, 2022, as Appl. No. 17/745,387.
Claims priority of application No. 10-2021-0126593 (KR), filed on Sep. 24, 2021.
Prior Publication US 2023/0107873 A1, Apr. 6, 2023
Int. Cl. H01L 51/00 (2006.01); C09D 5/22 (2006.01); C09D 11/037 (2014.01); C09D 11/30 (2014.01); H10K 71/15 (2023.01); H10K 50/11 (2023.01); H10K 71/13 (2023.01); H10K 101/10 (2023.01)
CPC C09D 11/037 (2013.01) [C09D 5/22 (2013.01); C09D 11/30 (2013.01); H10K 71/15 (2023.02); H10K 50/11 (2023.02); H10K 71/135 (2023.02); H10K 2101/10 (2023.02)] 13 Claims
OG exemplary drawing
 
1. An ink composition comprising:
a mixed solvent including a first solvent and a second solvent; and
a light emitting material, wherein
the first solvent and the second solvent each have a vapor pressure of about 1×10−4 or greater and a boiling point of about 270° C. or less, and
the light emitting material includes a host compound, and a dopant compound.