US 12,448,515 B2
Method for producing polyamide resin composition
Nobuhiro Yoshimura, Shiga (JP); and Ryo Umeki, Shiga (JP)
Assigned to TOYOBO MC CORPORATION, Osaka (JP)
Appl. No. 17/793,542
Filed by TOYOBO CO., LTD., Osaka (JP)
PCT Filed Jan. 19, 2021, PCT No. PCT/JP2021/001652
§ 371(c)(1), (2) Date Jul. 18, 2022,
PCT Pub. No. WO2021/149674, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 2020-009963 (JP), filed on Jan. 24, 2020.
Prior Publication US 2023/0104768 A1, Apr. 6, 2023
Int. Cl. C08L 77/02 (2006.01); C08G 69/46 (2006.01); C08J 3/22 (2006.01); C08K 3/04 (2006.01); C08K 3/105 (2018.01); C08K 7/10 (2006.01); C08K 7/14 (2006.01)
CPC C08L 77/02 (2013.01) [C08G 69/46 (2013.01); C08J 3/226 (2013.01); C08K 3/04 (2013.01); C08K 3/105 (2018.01); C08K 7/10 (2013.01); C08K 7/14 (2013.01); C08J 2377/00 (2013.01)] 2 Claims
 
1. A method for producing a polyamide resin composition containing a crystalline polyamide resin (A) containing a polycaproamide resin as a main component, a semi-aromatic amorphous polyamide resin (B), an inorganic reinforcing material (C), a master batch of carbon black (D), and a copper compound (E),
wherein:
the polyamide resin composition contains glass fiber (C-1), needle-shaped wollastonite (C-2), and a plate-shaped crystal inorganic reinforcing material (C-3) as the inorganic reinforcing material (C);
a melt mass flow rate (MFR) of the polyamide resin composition at a moisture content of 0.05% or less is 4.0 g/10 min or more and less than 13.0 g/10 min;
a temperature-lowering crystallization temperature (TC2) of the polyamide resin composition, the temperature-lowering crystallization temperature (TC2) being measured with a differential scanning calorimeter (DSC) is 180° C. or higher and 185° C. or lower;
a mass ratio of (A) to (B) satisfies 0.5<(B)/(A) ≤0.8;
when the total of (A), (B), (C), and (D) is 100 parts by mass, the content of (E) is 0.001 to 0.1 parts by mass;
the content of each of the components satisfies the following formulae:
30 parts by mass ≤(A)+(B)+(D)≤60 parts by mass;
13 parts by mass ≤(B)≤23 parts by mass;
1 part by mass ≤(D)≤5 parts by mass;
20 parts by mass ≤(C-1)≤40 parts by mass;
8 parts by mass ≤(C-2)≤25 parts by mass;
8 parts by mass ≤(C-3)≤25 parts by mass; and
40 parts by mass ≤(C-1)+(C-2)+(C-3)≤70 parts by mass;
a dispersion liquid of the copper compound (E) has a concentration of 0.04% by mass to 1.0% by mass; and
the crystalline polyamide resin (A) containing a polycaproamide resin as a main component, the semi-aromatic amorphous polyamide resin (B), the master batch of carbon black (D), and the dispersion liquid of the copper compound (E) are mixed in advance, followed by charging the mixture into a hopper part of an extruder, and charging the inorganic reinforcing material (C) into the extruder by a side feed method.