US 12,448,491 B2
Nano-patterend conductive polymer substrate with improved cell alignment, maturity, adhesion, and connectivity and method for manufacturing same
Dong Weon Lee, Gwangju (KR); and Yuyan Liu, Gwangju (KR)
Assigned to INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY, Gwangju (KR)
Filed by INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY, Gwangju (KR)
Filed on Sep. 21, 2022, as Appl. No. 17/949,694.
Claims priority of application No. 10-2022-0052069 (KR), filed on Apr. 27, 2022; and application No. 10-2022-0100721 (KR), filed on Aug. 11, 2022.
Prior Publication US 2023/0348683 A1, Nov. 2, 2023
Int. Cl. C08J 7/044 (2020.01); C08K 7/06 (2006.01); C12N 5/077 (2010.01)
CPC C08J 7/044 (2020.01) [C08K 7/06 (2013.01); C12N 5/0657 (2013.01); C08J 2383/04 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a conductive polymer substrate, the method comprising:
a first preparation step of preparing a first mold including a nanopatterned layer with a predetermined pitch distance on a surface thereof;
a second preparation step of bringing the first mold into contact with a first polymer material, followed by detachment of the first mold, so as to allow the first polymer material to have nanopatterns corresponding to nanopatterns of the first mold, and then curing the first polymer material to prepare a second mold having transferred nanopatterns;
a third preparation step of bringing the second mold into contact with a second polymer material, followed by detachment of the second mold, so as to allow the second material to have nanopatterns corresponding to the nanopatterns of the second mold, and then curing the second polymer material to prepare a polymer substrate having transferred nanopatterns;
a first coating step of spin-coating a conductive material on the polymer substrate having a nanopatterned layer on one side of the polymer substrate;
a second coating step of spin-coating a first polymer material on the conductive material-spin-coated side of the polymer substrate so as to allow the conductive material to be embedded in the first polymer material; and
a removal step of removing the polymer substrate.