US 12,448,485 B2
Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method
Hitoshi Maruyama, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Appl. No. 17/792,210
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
PCT Filed Jan. 13, 2021, PCT No. PCT/JP2021/000738
§ 371(c)(1), (2) Date Jul. 12, 2022,
PCT Pub. No. WO2021/149542, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 2020-010120 (JP), filed on Jan. 24, 2020.
Prior Publication US 2023/0076103 A1, Mar. 9, 2023
Int. Cl. C08G 77/14 (2006.01); C08G 77/42 (2006.01); C08G 77/52 (2006.01); C08L 63/04 (2006.01); G03F 7/075 (2006.01); H01L 21/02 (2006.01)
CPC C08G 77/14 (2013.01) [C08G 77/42 (2013.01); C08G 77/52 (2013.01); C08L 63/04 (2013.01); G03F 7/0757 (2013.01); H01L 21/02126 (2013.01); H01L 21/02216 (2013.01)] 13 Claims
 
1. A photosensitive resin composition comprising
(A) a silicone resin containing an epoxy group and/or phenolic hydroxy group, the silicone resin having the formula (A):

OG Complex Work Unit Chemistry
wherein R1 to R4 are each independently a C1-C8 monovalent hydrocarbon group, k is an integer of 1 to 600, a and b are numbers in the range: 0<a<1, 0<b<1, and a+b=1, and X is a divalent organic group containing an epoxy group and/or phenolic hydroxy group,
(B) an alkyl phenol novolak resin having the formula (B):

OG Complex Work Unit Chemistry
wherein R51 is a C1-C9 saturated hydrocarbyl group, R52 is a C10-C25 saturated hydrocarbyl group, n1 and n2 are numbers in the range: 0≤n1<1, 0<n2≤1, and n1+n2=1, m1 is an integer of 0 to 3, and m2 is an integer of 1 to 3, and
(C) a photoacid generator.