US 12,448,294 B2
Low thermal conductivity and low-k dielectric aerogel material and preparation method therefor
Jean-Hong Chen, Tainan (TW); and Shiu-Shiu Chen, Tainan (TW)
Assigned to Taiwan Aerogel Technology Material Co., Ltd., Tainan (TW)
Filed by Taiwan Aerogel Technology material Co., Ltd., Tainan (TW)
Filed on Apr. 28, 2022, as Appl. No. 17/731,789.
Prior Publication US 2023/0348284 A1, Nov. 2, 2023
Int. Cl. C01B 33/158 (2006.01); C01B 33/145 (2006.01); C01B 33/148 (2006.01); C01B 33/155 (2006.01); C08J 5/24 (2006.01); F16L 59/06 (2006.01)
CPC C01B 33/1585 (2013.01) [C01B 33/145 (2013.01); C01B 33/148 (2013.01); C01B 33/155 (2013.01); C08J 5/248 (2021.05); F16L 59/06 (2013.01); C08J 2363/00 (2013.01); C08J 2379/08 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for making a low thermal conductivity and low-k dielectric aerogel material, wherein the aerogel material comprises a pure aerogel, a fiber/aerogel composite, a polymer/aerogel composite, or a polymer/fiber/aerogel composite and the method comprising steps of:
mixing and hydrolysis step: adding a siloxane precursor to an ethanol water solution to form a mixed solution and then adding an acid catalyst to the mixed solution to perform a hydrolysis reaction, wherein the siloxane precursor comprises a hydrophobic siloxane compound, a siloxane compound or a combination thereof;
dispersion and condensation step: adding a dispersing solution to the mixed solution and then using an emulsifier or a stirring equipment to disperse the siloxane precursor to form a homogeneous sol, wherein the dispersing solution comprises a base catalyst;
molding step: injecting the sol to a mold so as to promote the sol to further condense into a solid-like aerogel wet-gel structure, wherein the mold comprises a molding mold or a molding mold comprising a fiber;
drying step: at atmospheric pressure, drying the solid-like aerogel wet-gel structure at a drying temperature so as to obtain the low thermal conductivity and low-k dielectric aerogel material with a homogeneous structure, wherein the drying temperature ranges from 60 to 150° C., the pure aerogel with thermal conductivity k ranging from 0.0113 to 0.018 W/(m·K), and the fiber/aerogel composite with thermal conductivity k ranging from 0.022 W/(m·K) to 0.032 W/(m·K); and
polymer solution impregnating step: preparing a polymer solution and injecting the polymer solution into the low thermal conductivity and low-k dielectric aerogel material so that a polymeric chain penetrates homogeneously into interior of the low thermal conductivity and low-k dielectric aerogel material to form a polymer solution-containing pure aerogel composite or a polymer solution-containing fiber/aerogel composite, wherein the polymer solution comprises a polymer and a mixing solvent, and the polymer comprises a thermosetting polymer, a thermoplastic polymer, a liquid crystalline polymer or a combination thereof; and
solvent drying step: placing the polymer solution-containing pure aerogel composite or the polymer solution-containing fiber/aerogel composite at a solvent drying temperature so as to vaporize the mixing solvent of the polymer solution, so that the polymer coats a network structure surface inside the pure aerogel or the fiber/aerogel composite or a fiber surface inside the fiber/aerogel composite to form the polymer/aerogel composite or the polymer/fiber/aerogel composite, wherein the solvent drying temperature ranges from 60 to 115° C.; wherein the polymer concentration in the polymer solution ranges from 0.01 wt % to 80.0 wt %.