US 12,447,732 B2
Method for offset cutting of display panel substrates to prevent separation of substrates upon placement, display panel, and display device
Qianqian Yang, Chuzhou (CN); Shishuai Huang, Chuzhou (CN); Bing Han, Chuzhou (CN); and Haijiang Yuan, Chuzhou (CN)
Assigned to CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., Chuzhou (CN); and HKC CORPORATION LIMITED, Shenzhen (CN)
Filed by Chuzhou HKC Optoelectronics Technology Co., Ltd., Chuzhou (CN); and HKC CORPORATION LIMITED, Shenzhen (CN)
Filed on Feb. 12, 2023, as Appl. No. 18/108,650.
Application 18/108,650 is a division of application No. 17/382,298, filed on Jul. 21, 2021, granted, now 11,602,927.
Prior Publication US 2023/0191770 A1, Jun. 22, 2023
Int. Cl. B32B 38/18 (2006.01); B32B 17/10 (2006.01); H01L 21/78 (2006.01)
CPC B32B 38/185 (2013.01) [B32B 17/10 (2013.01); B32B 2457/20 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a first substrate,
a second substrate, the second substrate disposed opposite to the first substrate, and
at least one chip on film bound to at least one side edge of the first substrate,
wherein the display panel is divided into a display area and a non-display area, an edge of the first substrate exceeds an edge of the corresponding second substrate at a side edge where the first substrate is not bound to the chip on film, and the edge of the second substrate is closer to the display area of the display panel than the edge of the first substrate.